ProductsAnalog
High CCC (current carrying capacity) Contact Probe
In recent years, with the mass production of a wide range of electronic products in the industrial equipment field, the demand for high-current test using power electronics devices used in those products is increasing. In a high-current test environment, the risk of low yield exponentially increases due to short Pogo Pin life, such as burning the tip of Pogo pin and the spring, reduction of the spring pressure, and discoloration of the tube, etc. Yokowo offers contactors that can maintain consistent performance in these demanding test environments.
Description | Equipment | |
---|---|---|
Customer Production Site Test | Yokowo Testing | |
Mechanical Stress | Yes | Yes |
Electrical Stress | Yes | Yes |
Thermal Stress | Yes | Yes |
Test Current / On time | Adjustable | Adjustable |
Test temp(C) | Adjustable | Adjustable |
Contact resistance Check at every insertion | Yes | Yes |
Force Check at every insertion | No | No |
High CCC testing machine
Overview
- Applicable packages
- QFN, QFP, TSSOP, BGA, LGA, WLCSP
- Minimum Pitch
- 0.4mm~
- Features
-
- Kelvin/Dual Contact、Narrow pitch, Higher CCC, Low Cres, Tri-Temp,
- High Current Definition:8A+specified pulse = 200k Touchdown/1pogo pin
- Internally developed test environment, METS Test(Mechanical, Electrical and Thermal Stress), re-creates customer test environment.
The current carrying capacity depends on the application conditions. Please contact us for details.
Heat Dissipation Socket
As IC packages require to be used at harsh environment ,need of high temperature testing is also increasing. One of the requirement for high temperature testing is to keep the socket temperature at certain range, in order not to stop running machine by reaching out to temperature limit.
Our heat dissipation socket consists of center ground block which will act ground for heat and also ground for signal .
Custom manual lid that will be effective for heat dissipation is also available upon customer’s request.
Depending on the package and requirement, Yokowo will choose the best socket body material and offer a best solution which will best fit to customer needs .
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Application
- Power management IC, automotive, etc
- Applicable packages
- QFN, QFP, BGA, LGA, TSSOP, WLCSP,etc
- Pitch
- 0.4mm~
- Features
-
- High temperature contactor available:up to 150℃
- Thermal fluid analysis is also available upon customer’s request
Different type of heat dissipation socket is also available (air purge under socket)
Package Test Strip Socket
In order to reduce the cost, time, and man-hours required for testing, Yokowo’s strip sockets are used to conduct room/high-temperature testing in a matrix of Strip frames without the need to singulate the devices.
To prevent multi-site socket warpage, our company provides an optimal test environment that meets your testing requirements, including high current measurements, Kelvin/Dual contacts and flexible pin assignment, as well as simulations to ensure safety.
In addition, the high-precision processing technology that makes these products a reality also ensures a reliable quality environment for our customers.
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Applicable package type
- QFN, TSSOP, BGA
- Pitch
- 0.4mm~
- Features
-
- Several plastic materials to choose from
- Optional manual test hardware (Guide, Manual Actuator)
- High parallelism (up to 64site)
- Optional Kelvin/Dual Contact
- Optional High CCC pins available
Kelvin Probe Head and Socket
The Kelvin connection, which is a 4-terminal connection, is often used to measure electrical resistance more accurately when the measured object has a relatively low resistance value. In order to make contact with device that is becoming increasingly narrow-pitched with the need for 2-terminal Force (current path) and 2-terminal Sense (voltage measurement) wires, Yokowo has minimized the gap between 2 probes and designed probes to withstand lateral loads, providing a safe environment for electrical and logistical evaluation.
Overview
- Applicable package type
- QFN, WLCSP
- Pitch
- 0.35mm~
- Features
-
- High current/High temperature capable pins
- Optimized Kelvin placement according to device requirements
- Properly control warpage of probe heads/sockets and planarity of the pins